Universal Interface Board
ER-DSPB-3U1
1. Work Temperature: -40°C~70°C;
2. Storage Temperature: -55°C~125°C;
3. Power Consumption: ≤35W.
ER-DSPB-3U1
1. Work Temperature: -40°C~70°C;
2. Storage Temperature: -55°C~125°C;
3. Power Consumption: ≤35W.
ER-RLG-120 (≤0.001°/h)
1. Bias stability: ≤0.001°/h;
2. Bias repeatability: ≤0.0003°/h;
3. Angular random walk: ≤0.00015°/√h.
ER-DSPB-3U2
1. Storage Temperature: -55°C~+125°C;
2. Power Consumption: ≤45W;
3. Heat-dissipating Method: Cooling Conduction.
ER-DSPB-6U1
1. Work Temperature: -40°C~70°C;
2. Storage Temperature: -55°C~125°C;
3. Power Consumption: ≤60w.
ER-DSPB-6U2
1. Work Temperature: -40°C~70°C;
2. Storage Temperature: -55°C~125°C;
3. Power Consumption: ≤60W.
ER-CPU-20K
1. Master frequency: 500~800MHz;
2. Microarchitecture: Double emission out of order execution;
3. Single-core 64-bit.
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ER-CPU-21K
1. Integrated and shared 1MB Level 2 Cache;
2. Integrated GPU;
3. Integrated display controller, supporting dual-channel DVO display.
ER-AS-90 Fearures:
1. Accuracy: 0.01g, resolution: 0.001g;
2. Three axes (X, Y, Z) are optional;
3. Impact resistance 2000g.
ER-AS-95 Features:
1. Accuracy: 0.01g, resolution: 0.001g;
2. Three axes (X, Y, Z) are optional;
3. Impact resistance 2000g.
ER-FOG-60 (0.06~0.5º/h)
1. Bias stability: 0.06~0.5º/h;
2. Small size: Φ60mm×30mm;
3. Light weight: ≤120g.
ER-CPU-21KLA
1. Master Frequency: 1GHz;
2. Microarchitecture: Double emission out of order execution Arch;
3. Power Consumption 1~5W (support dynamic frequency and voltage reduction)
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ER-3MG-09
1. Cylinder;
2. Bias Instability (1σ 25℃): 0.01-0.02º/h;
3. Size: 120mm x Φ30mm.
ER-3MG-10
1. Cylinder;
2. Bias Instability (1σ 25℃): 0.03º/h;
3. Size: 120mm x Φ30mm.
ER-CPU-22K
1. Integrated 72-bit DDR4 Controller (including 8-bit ECC);
2. Integrated two SATA3.0 interfaces;
3. Adopt FC-BGA encapsulation.
ER-CPU-35A/35B
1. Based on New Arch™;
2. High bandwidth memory interface: Support DDR4-3200, the actual bandwidth is more than 25GB/s;
3. Integrated Eco-compatibility: Real-time translation for applications with different architectures.
ER-CPU-35C
1. New instruction system;
2. High-end multiplexing;
3. High system performance.
ER-TS-22800 Feature:
1. Accuracy: 0.005°, resolution: 0.0008°;
2. Measurement range: ± 30°;
3. Volume (94*74*64mm) (customizable).
ER-CPU-71A
1. Graphics card memory: 16-bit DDR3 controller;
2. Supports dual-channel DVO display;
3. Power Consumption5-8W.
ER-TS-32600-Modbus Features:
1. Dual axis monitoring (single axis optional);
2. Full range accuracy 0.01°, resolution 0.002°;
3. Volume (94*74*64mm) (customizable).
ER-3MG-11
1. Cylinder;
2. Bias Instability (1σ 25℃): 0.3-0.1º/h;
3. Light Weight.
ER-3MG-12
1. Cylinder;
2. Bias Instability (1σ 25℃): 1º/h;
3. Light Weight.
ER-CPU-72A
1. Supports up to 16GB video memory capacity;
2. PCIE, USB, and SATA are all upgraded to 3.0;
3. One GMAC network port +1RGMII port.
ER-3MG-14
1. Thin;
2. Light weight;
3. Simple structure and good reliability.
ER-FOG-70 (0.05~0.1º/h)
1. Bias stability: 0.05~0.1º/h;
2. Small size;
3. Light weight.