Universal Interface Board

ER-DSPB-3U1
1. Work Temperature: -40°C~70°C;
2. Storage Temperature: -55°C~125°C;
3. Power Consumption: ≤35W.

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Introduction

Universal Interface Board

Product Profile

The ER-DSPB-3U1 board is a universal interface board of “ER-DSPC-20A”, which meets the Open VPX platform standard. It provides LVDS interface for SAR image transmission, multi-channel Rapid IO high-speed communication interface, echo recording interface, multi-channel 422/TTL control interface. The board can provides hardware support for high-speed real-time signal processing tasks such as sonar, instrumentation and medical electronics.

Technical Indicators

Processing Capacity:

1 piece HXDSP1042 computing power 84G FLOPS

1 piece XC7K325T processing capacity: 840 DSP48E1 Slices

Storage Capacity:

DSP external DDR3 memory, total capacity: 2GBytes

DSP chip external 128Mb SPI NOR FLASH, used for DSP Boot

Transmission Bandwidth:

DSP 4x Rapid IO connects to FPGA implementation and external data exchange single line rate 5Gbps.

Slow Interface:

The DSP is debugged and updated by the network port. The serial LVDS interface is used for image transmission of dedicated coding chips such as MAX9247 and Si8660.

Other:

The board has power-on self-test, function detection and temperature monitoring functions. The fault can be located on the main chip, and the DSP program can be updated through the network and Rapid IO

Physical Characteristics:

Size: Standard 3U board

Work Temperature: -40°C~70°C

Storage Temperature: -55°C~125°C

Power Consumption: ≤35W

Heat-dissipating Method: Cooling Conduction